The BGA Chips are mechanically very robust. The balls are usually attached to the chip with a small amount of adhesive, and not with solder. This allows for some misalignment between the balls and contact pads on the chip without causing mechanical damage. A ball grid array ( BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. It is a kind of a surface mount package which is used in electronic products to mount integrated circuits such as microprocessors. The offered BGA Chips are made for use in the various applications. They are easy to install.